Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Honchin En0
Date of Patent
October 12, 2010
Patent Application Number
12071964
Date Filed
February 28, 2008
Patent Primary Examiner
Patent abstract
The objective of present invention is to provide an electroplating solution capable of forming the upper face of a via-hole and the upper face of a conductor circuit in the same layer in approximately the same plane at the time of manufacturing a multilayer printed circuit board. The electroplating solution of the present invention is characterized by containing 50 to 300 g/L of copper sulfate, 30 to 200 g/L of sulfuric acid, 25 to 90 mg/L of chlorine ion, and 1 to 1000 mg/L of an additive comprising at least a leveling agent and a brightener.
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