Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 12, 2010
Patent Application Number
12129857
Date Filed
May 30, 2008
Patent Primary Examiner
Patent abstract
A through-silicon via (TSV) enabled twisted pair is provided. A pair of complementary conductive lines is provided as a twisted pair. Each of the conductive lines of the twisted pair is formed by alternating conductive sections on opposing sides of a substrate. The alternating conductive sections are electrically coupled by at least in part a TSV. The conductive lines overlap or are entwined such the point at which the conductive lines cross, the conductive lines are on opposing sides of the substrate. The conductive lines are weaved in this manner for the length of the conductive trace.
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