US Patent 7812440 Electronic package device, module, and electronic apparatus
Patent 7812440 was granted and assigned to NEC Corporation on October, 2010 by the United States Patent and Trademark Office.
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There is provided an electronic device package and the like in which it is not likely that damage occurs in a wiring pattern of an interposer substrate in a gap section formed, for example, between an electronic device and an insertion substrate. The semiconductor package in accordance with the present invention is a package of fan-out type including an interposer substrate and a semiconductor device and an insertion substrate which are arranged on the substrate. The interposer substrate 3 includes a wiring pattern therein. A gap is formed between the semiconductor device and the insertion substrate; in an area corresponding to the gap, a reinforcing member (a metallic film 7) is formed to increase strength of the wiring pattern.
US Patent 07812440 Electronic package device, module, and electronic apparatus US Patent 7812440 Electronic package device, module, and electronic apparatus
US Patent 07812440 Electronic package device, module, and electronic apparatus
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