US Patent 7814651 Method for fabricating a through-hole interconnection substrate
Patent 7814651 was granted and assigned to Fujikura on October, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A blind hole (3) is formed on a substrate (1) from a first side of the substrate toward a second side of the substrate (1). A conductor (11) is filled in the blind hole (3). The substrate (1) is removed from the opposite side to expose the conductor (13) filled in the blind hole (3).
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US Patent 07814651 Method for fabricating a through-hole interconnection substrate US Patent 7814651 Method for fabricating a through-hole interconnection substrate
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Patent Number
0781465100
Patent Number
781465100
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078146510
Date of Patent
October 19, 2010
0Patent Application Number
117395750
Date Filed
April 24, 2007
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078146510
Date of Patent
October 19, 2010
0Patent Application Number
117395750
Date Filed
April 24, 2007
0Official Website
Patent Primary Examiner
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US Patent 07814651 Method for fabricating a through-hole interconnection substrate
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07814651
Date of patent
October 19, 2010
Patent application number
11739575
Date Filed
April 24, 2007
Patent primary examiner
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