Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 19, 2010
Patent Application Number
11798154
Date Filed
May 10, 2007
Patent Primary Examiner
Patent abstract
A polyimide resin composition modified with bismaleimide and cyanate, which comprises (a) polyimide resin, (b) cyanate, (c) bismalemide, and (d) nanometer filler. By using the present polyimide resin composition modified with bismalemide and cyanate, heat expansion coefficient of polyimide can be reduced. Also, heat resistance and dimension stability of the polyimide resin can be improved, and thus it is suitable for cladding with copper foil to produce printed circuit board.
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