Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 19, 2010
Patent Application Number
11762479
Date Filed
June 13, 2007
Patent Primary Examiner
Patent abstract
The present invention provides for a BGA solder ball interconnection to an outer conductive layer of a laminated circuit assembly having an underlying circuit layer. The invention includes a raised BGA solder ball pad substantially co-planar with the outer conductive layer, the raised pad having a raised face and a plurality of vertical conductive walls and a BGA solder ball having an average diameter of greater than the width of the raised face, the BGA solder ball being adhered to the raised face and to a substantial portion of the vertical conductive walls.
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