Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wayne G. Renken0
Date of Patent
October 26, 2010
0Patent Application Number
121069980
Date Filed
April 21, 2008
0Patent Citations Received
Patent Primary Examiner
0
Patent abstract
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing chamber by a robot head and the measuring device can transmit the conditions in real time or store the conditions for subsequent analysis. Sensitive electronic components of the device can be distanced or isolated from the most deleterious processing conditions in order increase the accuracy, operating range, and reliability of the device.
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