Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 26, 2010
Patent Application Number
12175992
Date Filed
July 18, 2008
Patent Primary Examiner
Patent abstract
A method for making a multilayer chemical mechanical polishing pad comprising: providing a polishing layer, providing a subpad layer, optionally providing additional layers, providing an unset reactive hot melt adhesive, applying the unset reactive hot melt adhesive in a pattern on a surface of at least one of the layers, applying one of the other layers over the pattern of unset reactive hot melt adhesive, pressing the two layers together with the unset reactive hot melt adhesive interposed therebetween, allowing the unset reactive hot melt adhesive to set forming a reactive hot melt adhesive bond between the two layers.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
