Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 26, 2010
Patent Application Number
12408062
Date Filed
March 20, 2009
Patent Primary Examiner
Patent abstract
A manufacturing method of a semiconductor device includes providing an adhesive on a supporting board, the supporting board being where a semiconductor element is to be mounted; providing a member configured to block flow of the adhesive on a first main surface of the semiconductor element, the semiconductor element having a second main surface where an outside connection terminal is provided; mounting the semiconductor element on a part of the supporting board where the adhesive is provided by pressing the semiconductor element via the member.
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