US Patent 7820545 Methods of forming conductive interconnects
Patent 7820545 was granted and assigned to Micron Technology on October, 2010 by the United States Patent and Trademark Office.
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Patent abstract
The invention includes methods of electroless plating of nickel selectively on exposed conductive surfaces relative to exposed insulative surfaces. The electroless plating can utilize a bath which contains triethanolamine, maleic anhydride and at least one nickel salt.
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US Patent 07820545 Methods of forming conductive interconnects US Patent 7820545 Methods of forming conductive interconnects
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Patent Number
0782054500
Patent Number
782054500
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Official Website
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078205450
Date of Patent
October 26, 2010
0Patent Application Number
120343780
Date Filed
February 20, 2008
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078205450
Date of Patent
October 26, 2010
0Patent Application Number
120343780
Date Filed
February 20, 2008
0Official Website
Patent Primary Examiner
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US Patent 07820545 Methods of forming conductive interconnects
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07820545
Date of patent
October 26, 2010
Patent application number
12034378
Date Filed
February 20, 2008
Patent primary examiner
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