Patent attributes
An earphone assembly (100) includes an insulative body (1), an audio plug (5) and an earphone (3). The insulative body (1) includes a main body (11), two side walls (12) located at two sides of the main body (11) and a connecting portion (13) connecting with the main body (11) and the two side walls (12). The main body (11), the side walls (12) and the connecting portion (13) together define a receiving space (10). The audio plug (5) is retained in the bottom of the connecting portion (13). The earphone (3) includes two headphones (31) and two rings (33) respectively connecting with the headphones (31) and the audio plug (5). The side walls (12) respectively form a pair of bulges (14) extending transversely and outwardly. The rings (33) include two resilient sections (331) respectively received in the bulges (14) and capable of elastically moving along the extending direction of the bulges (14) for changing the position of the headphones (31).
