System, method and program for inductance analysis for reducing time for analysis, to cope with increase in the system size, to achieve high accuracy in the analysis. Information on a power supply plane, in a state in which a beginning point of non-coupled current of return current accompanying a signal current is placed in the vicinity of a signal through-hole on the power supply plane, based on position information of said signal through-hole, is received. Potential distribution in the power supply plane is determined and output. The non-coupled inductance from the signal through-hole to the power supply through-hole in the power supply plane is evaluated. In the potential analysis, non-coupled inductance L from the signal through-hole to the power supply through-hole is represented by resistance R. The relationship that a voltage increment ΔV is represented by the product of the non-coupled inductance L and the rate of time change of the current, ΔV=LΔI/Δt, is replaced by the relationship that the voltage V is represented by the product of resistance R and non-coupled current I, V=R×I. Potential analysis is performed by analyzing two-dimensional heat diffusion in the power supply plane assuming that a heat source is placed at a beginning point of the non-coupled current.