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US Patent 7823102 Thermally aware design modification

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 16, 2008
Date of Patent
October 26, 2010
Patent Application Number
12140188
Patent Citations Received
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US Patent 12027391 Electromigration evaluation methodology with consideration of thermal and signal effects
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US Patent 11658049 Electromigration evaluation methodology with consideration of thermal and signal effects
0
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US Patent 11657199 Method for analyzing electromigration (EM) in integrated circuit
0
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US Patent 11961823 Forming and/or configuring stacked dies
0
Patent Inventor Names
Adi Srinivasan
0
Nanda Gopal
0
Rajit Chandra
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
7823102
Patent Primary Examiner
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Stacy A. Whitmore

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