Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Wataru Sugimura0
Masataka Hourai0
Toshiaki Ono0
Date of Patent
November 2, 2010
Patent Application Number
11184869
Date Filed
July 20, 2005
Patent Primary Examiner
Patent abstract
A method for manufacturing a silicon wafer includes a step of annealing a silicon wafer which is sliced from a silicon single crystal ingot, thereby forming a DZ layer in a first surface and in a second surface of the silicon wafer and a step of removing either a portion of the DZ layer in the first surface or a portion of the DZ layer in the second surface.
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