Patent attributes
A chip-carrier module known from smart card technology is adapted as an electrode array for use in disposable sensing or separation devices containing electrodes. The electrodes are manufactured directly onto chip-carrier module. The preferred electrode module includes a chip-carrier module and at least one electrode formed thereon, the chip-carrier module being a laminate of a metal foil and an insulator foil, which metal foil is divided into at least two conductor regions, the insulator foil having a perforation over each conductor region, and the at least one electrode being formed by a membrane layer applied to the insulating foil to extend through one of the perforations for electrical contact with the conductor region associated therewith, the membrane layer imparting chemical sensitivity to the electrode. The result is an electrode module for use in disposable sensing or separation devices containing electrodes, whose unit cost of manufacture is low even at modest manufacturing volume.
