Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Phillip Celaya0
James P. Letterman, Jr.0
Date of Patent
November 2, 2010
Patent Application Number
12616453
Date Filed
November 11, 2009
Patent Primary Examiner
Patent abstract
In one embodiment, a semiconductor package is formed to include a tamper barrier that is positioned between at least a portion of the connection terminals of the semiconductor package and an edge of the semiconductor package.
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