Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 2, 2010
Patent Application Number
11778511
Date Filed
July 16, 2007
Patent Primary Examiner
Patent abstract
An integrated circuit structure is provided. The integrated circuit structure includes a die and an anisotropic conducing film (ACF) adjoining the back surface of the die. The die includes a front surface; a back surface on an opposite side of the die than the front surface; and a through-silicon via (TSV) exposed through the back surface of the die.
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