US Patent 7829363 Method and apparatus for microjoining dissimilar materials

Disclosed are apparatus and methods that provide for electrical contacts in a substrate. For example, the apparatus may comprise a trench formed in a substrate, with an electrical contact pad formed on interior walls of the trench that comprises a narrowed opening. A conductive wire is squeezed into the trench that is secured by mechanical stress resulting from material deformation. One exemplary method comprises depositing metal on walls of the trench such that a narrowed opening is provided, and disposing a conductive wire in the trench so that it contacts the deposited metal and is secured by mechanical stress resulting from material deformation. Another exemplary method comprises providing a substrate having a trench formed therein, placing a conductive wire in the trench, and depositing metal atoms into the trench to bury the wire and provide exposed metal on a surface of the substrate.