US Patent 7829441 Thermosetting die-bonding film
Patent 7829441 was granted and assigned to Nitto Denko on November, 2010 by the United States Patent and Trademark Office.
All edits
Edits on 31 Oct, 2023
Golden AI
Edits made to:
Article (+598 characters)
Article
Patent abstract
A thermosetting die-bonding film having excellent adhesion to an adherent and preferable pickup properties and a dicing die-bonding film having the thermosetting die-bonding film are provided. The thermosetting die-bonding film of the present invention is a thermosetting die-bonding film that is used when manufacturing a semiconductor device and contains 15 to 30% by weight of a thermoplastic resin component and 60 to 70% by weight of a thermosetting resin component as main components, wherein a surface free energy before heat curing is 37 mJ/m2 or more and less than 40 mJ/m2.
Edits on 23 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07829441 Thermosetting die-bonding film US Patent 7829441 Thermosetting die-bonding film
Infobox
Patent Number
0782944100
Patent Number
782944100
Edits on 21 May, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 27 Mar, 2023
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078294410
Date of Patent
November 9, 2010
0Patent Application Number
125292110
Date Filed
February 4, 2008
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
Golden AI
Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078294410
Date of Patent
November 9, 2010
0Patent Application Number
125292110
Date Filed
February 4, 2008
0Official Website
Patent Primary Examiner
Edits on 3 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 6 Dec, 2021
Golden AI
Edits made to:
Infobox (+8 properties)
US Patent 07829441 Thermosetting die-bonding film
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07829441
Date of patent
November 9, 2010
Patent application number
12529211
Date Filed
February 4, 2008
Patent primary examiner
Find more entities like US Patent 7829441 Thermosetting die-bonding film
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
