US Patent 7829977 Low temperature co-fired ceramics substrate and semiconductor package
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Patent abstract
A low-temperature co-fired ceramics (LTCC) substrate includes a plurality of substrate units and at least one cutting pattern. The cutting pattern is disposed between neighboring two of the substrate units. A semiconductor package including the LTCC substrate is also disclosed.
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Patent Inventor Names
Hyun-Ok Shin0
Sang-Yun Lee0
Sung-Hun Choi0
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US Patent 07829977 Low temperature co-fired ceramics substrate and semiconductor package US Patent 7829977 Low temperature co-fired ceramics substrate and semiconductor package
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Patent Number
078299770
Patent Number
78299770
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Official Website
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Patent Jurisdiction
Patent Number
078299770
Date of Patent
November 9, 2010
0Patent Application Number
119409610
Date Filed
November 15, 2007
0Official Website
Patent Primary Examiner
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US Patent 07829977 Low temperature co-fired ceramics substrate and semiconductor package
Infobox
Is a
Patent jurisdiction
Patent number
07829977
Date of patent
November 9, 2010
Patent application number
11940961
Date Filed
November 15, 2007
Patent primary examiner
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