Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Horst Theuss0
Adolf Koller0
Date of Patent
November 9, 2010
0Patent Application Number
118762410
Date Filed
October 22, 2007
0Patent Primary Examiner
Patent abstract
A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side; a contact pad disposed on the active surface; and a metallization layer extending from the contact pad onto a portion of the peripheral sides of the chip.
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