Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
November 16, 2010
Patent Application Number
12187601
Date Filed
August 7, 2008
Patent Primary Examiner
Patent abstract
The present invention is a method for manufacturing a semiconductor apparatus including a chip which is fabricated in large numbers on a wafer and has a plurality of information blocks. In the method, a unique information bit is written in a chip discrimination block of each chip within a shot, which is a segmented region of the wafer, by a fixed pattern method. In addition, an information bit uniquely given to each shot within the wafer is written by a mask shift method. Further, an information bit uniquely given to each wafer is written in a wafer discrimination block of the chip which is fabricated on the wafer by the mask shift method and mask combination method.
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