US Patent 7838206 Substrate processing method and substrate processing apparatus
Patent 7838206 was granted and assigned to Dainippon Screen Mfg Co on November, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A substrate processing method according to the present invention is to be applied for stripping and removing, from the surface of a substrate, a resist no longer required. According to the substrate processing method, a resist stripping liquid is supplied to the center portion of the surface of a substrate held by a substrate holding unit. An organic solvent liquid is supplied to the peripheral edge portion of the surface of the substrate held by the substrate holding unit.
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Patent Inventor Names
Akio Hashizume0
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Official Website
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US Patent 07838206 Substrate processing method and substrate processing apparatus US Patent 7838206 Substrate processing method and substrate processing apparatus
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Patent Number
078382060
Patent Number
78382060
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
078382060
Date of Patent
November 23, 2010
0Patent Application Number
117583890
Date Filed
June 5, 2007
0Official Website
Patent Primary Examiner
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US Patent 07838206 Substrate processing method and substrate processing apparatus
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07838206
Date of patent
November 23, 2010
Patent application number
11758389
Date Filed
June 5, 2007
Patent primary examiner
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