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US Patent 7838419 Systems and methods to laminate passives onto substrate

Patent 7838419 was granted and assigned to Intel on November, 2010 by the United States Patent and Trademark Office.

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Patent abstract

A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.

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