Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih-Yi Huang0
Chia-Hsing Chou0
Date of Patent
November 23, 2010
Patent Application Number
11620430
Date Filed
January 5, 2007
Patent Primary Examiner
Patent abstract
A signal transmission structure including a first signal pad, a first reference plane surrounding the first signal pad, a second signal pad, a second reference plane surrounding the second signal pad, an electric conductive element, and a conductive wall is provided. The second reference plane is parallel to the first reference plane, and the electrical conductive element is connected between the first signal pad and the second signal pad to transmit a signal. The conductive wall is connected between the first reference plane and the second reference plane and surrounding the electrical conductive element. Furthermore, a package structure applying to the signal transmission structure and a bonding method thereof are provided.
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