Patent attributes
A circuit board having a method therefor comprises a first circuit board layer comprising a first surface having disposed thereon a first plurality of lands arranged in three rows and comprising at least one group of the lands, wherein each group of the lands comprises first and second ones of the lands arranged in a first one of the rows, third, fourth, and fifth ones of the lands arranged in a second one of the rows, and sixth and seventh ones of the lands arranged in a third one of the rows, wherein the second one of the rows is adjacent to, and lies between, the first one of the rows and the third one of the rows; and respective traces extending from the first, second, third, fourth, fifth, and sixth ones of the lands between the sixth and seventh ones of the lands.
