Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kai Di Feng0
Louis Lu-Chen Hsu0
Ping-Chuan Wang0
Zhijian Yang0
Date of Patent
November 23, 2010
Patent Application Number
12357659
Date Filed
January 22, 2009
Patent Primary Examiner
Patent abstract
Through silicon vias (TSVs) in silicon chips are both programmable and non-programmable. The programmable TSVs may employ metal/insulator/metal structures to switch from an open to shorted condition with programming carried out by complementary circuitry on two adjacent chips in a multi-story chip stack.
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