US Patent 7841884 Land grid array connector

An LGA connector, for interconnecting an IC package with a printed circuit board, includes an insulative housing having a number of electrical terminals received therein, a metal stiffener mounted to the insulative housing, a cover and a lever pivotally engaged to two opposite ends of the stiffener, respectively. The insulative housing defines an opening for receiving the IC package and two walls extending upwardly thereof, and each wall disposes a first cutout. The stiffener surrounding the insulative housing defines two side walls adjacent and parallel to the walls of the insulative housing. Each side wall disposes a second cutout corresponding to the first cutout so as to so as to remove the IC package easily.