US Patent 7842169 Method and apparatus for local polishing control
Patent 7842169 was granted and assigned to Applied Materials on November, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.
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US Patent 07842169 Method and apparatus for local polishing control US Patent 7842169 Method and apparatus for local polishing control
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Patent Number
0784216900
Patent Number
784216900
Edits on 27 Mar, 2023
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078421690
Date of Patent
November 30, 2010
0Patent Application Number
103820320
Date Filed
March 4, 2003
0Official Website
Patent Primary Examiner
Edits on 24 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078421690
Date of Patent
November 30, 2010
0Patent Application Number
103820320
Date Filed
March 4, 2003
0Official Website
Patent Primary Examiner
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US Patent 07842169 Method and apparatus for local polishing control
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07842169
Date of patent
November 30, 2010
Patent application number
10382032
Date Filed
March 4, 2003
Patent primary examiner
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