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US Patent 7842541 Ultra thin package and fabrication method
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Patent
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Date Filed
September 24, 2008
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Date of Patent
November 30, 2010
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Patent Application Number
12237173
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Patent Citations Received
US Patent 11784168 Semiconductor chip, semiconductor device, and semiconductor package including the semiconductor chip
US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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Patent Inventor Names
Ronald Patrick Huemoeller
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Bob Shih-Wei Kuo
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Lee John Smith
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Sukianto Rusli
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
7842541
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Patent Primary Examiner
S. V. Clark
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