Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 30, 2010
Patent Application Number
11871204
Date Filed
October 12, 2007
Patent Primary Examiner
Patent abstract
A structure and a method for forming the same. The structure includes (i) a carrier substrate which includes substrate pads, (ii) a chip physically attached to the carrier substrate, and (iii) a first frame physically attached to the carrier substrate. A CTE (coefficient of thermal expansion) of the first frame is substantially lower than a CTE of the carrier substrate.
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