Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yoshiaki Shimizu0
Date of Patent
November 30, 2010
0Patent Application Number
123437400
Date Filed
December 24, 2008
0Patent Primary Examiner
Patent abstract
According to the present invention, on a double-sided substrate 1, a plurality of through-holes 2 connected to one wire 6 for plating as well as wiring are collectively arranged within a narrow range close to the connection portion. After a plating process, a penetrating hole 12 is formed and the connection potion is cut off. Thus, the wire 6 for plating and the collectively arranged through-holes 2 are made independent of one another so that no electric conduction occurs among the wire 6 for plating and the through-holes 2.
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