Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Haruyuki Hiratsuka0
Takao Kasai0
Date of Patent
November 30, 2010
0Patent Application Number
117957150
Date Filed
January 20, 2006
0Patent Primary Examiner
Patent abstract
There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal (31) is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.
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