Patent attributes
A semiconductor device includes a semiconductor substrate having, on a surface thereof, a (110) surface of Si1-xGex (0.25≦x≦0.90), and n-channel and p-channel MISFETs formed on the (110) surface, each MISFET having a source region, a channel region and a drain region. Each MISFET has a linear active region which is longer in a [−110] direction than in a [001] direction and which has a facet of a (311) or (111) surface, the source region, the channel region and the drain region are formed in this order or in reverse order in the [−110] direction of the linear active region, the channel region of the n-channel MISFET is formed of Si and having uniaxial tensile strain in the [−110] direction, and the channel region of the p-channel MISFET being formed of Si1-yGey (x<y≦1) and having uniaxial compressive strain in the [−110] direction.
