Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Liang-Chen Lin0
Pao-Kang Niu0
Pei-Haw Tsao0
Date of Patent
November 30, 2010
0Patent Application Number
119289710
Date Filed
October 30, 2007
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
