US Patent 7845548 Lamination method
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Patent abstract
The present invention is directed to a lamination method. The lamination method includes making the interior of a process chamber a vacuum, the process chamber including a first and a second metal sheet, supplying the first and the second metal sheets, injecting a bonding material between the first and the second metal sheets supplied, bonding the first and the second metal sheets with each other, and heating the bonded metal sheets. The first metal sheet is a superconductive tape, and the second metal sheet is stabilization metal tape.
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Patent Inventor Names
Ho-Sup Kim0
Hong-Soo Ha0
Kyu-Jeong Song0
Rock-Kil Ko0
Sang-Soo Oh0
Tae-Hyung Kim0
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US Patent 07845548 Lamination method US Patent 7845548 Lamination method
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Patent Number
078455480
Patent Number
78455480
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Official Website
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Infobox
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Patent Jurisdiction
Patent Number
078455480
Date of Patent
December 7, 2010
0Patent Application Number
125744570
Date Filed
October 6, 2009
0Official Website
Patent Primary Examiner
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US Patent 07845548 Lamination method
Infobox
Is a
Patent jurisdiction
Patent number
07845548
Date of patent
December 7, 2010
Patent application number
12574457
Date Filed
October 6, 2009
Patent primary examiner
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