US Patent 7846317 Processing a printed wiring board by single bath electrodeposition
Patent 7846317 was granted and assigned to Lawrence Livermore National Security (company) on December, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A method of processing a printed wiring board. Initial processing steps are implemented on the printed wiring board. Copper is plated on the printed wiring board from a bath containing nickel and copper. Nickel is plated on the printed wiring board from a bath containing nickel and copper and final processing steps are implemented on the printed wiring board.
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US Patent 07846317 Processing a printed wiring board by single bath electrodeposition US Patent 7846317 Processing a printed wiring board by single bath electrodeposition
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Patent Number
0784631700
Patent Number
784631700
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Official Website
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Is a
Current Assignee
Patent Jurisdiction
Patent Number
078463170
Date of Patent
December 7, 2010
0Patent Application Number
103733500
Date Filed
February 24, 2003
0Official Website
Patent Primary Examiner
Edits on 23 Sep, 2022
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Infobox
Is a
Current Assignee
Patent Jurisdiction
Patent Number
078463170
Date of Patent
December 7, 2010
0Patent Application Number
103733500
Date Filed
February 24, 2003
0Official Website
Patent Primary Examiner
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US Patent 07846317 Processing a printed wiring board by single bath electrodeposition
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07846317
Date of patent
December 7, 2010
Patent application number
10373350
Date Filed
February 24, 2003
Patent primary examiner
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