Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 7, 2010
Patent Application Number
11680061
Date Filed
February 28, 2007
Patent Citations Received
Patent Primary Examiner
Patent abstract
A package and a package assembly for a power device having a high operation voltage and impulse voltage are provided. The package assembly for a power device comprises an assembly wherein the power device is encapsulated and electrically connected to a lead protruding outside the package, and an isolation spacer filling a clearance distance between the package and a heat sink attached to the package.
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