Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 7, 2010
Patent Application Number
12099424
Date Filed
April 8, 2008
Patent Primary Examiner
Patent abstract
A grinding method wherein the correlation between the amount of inertial grinding occurring in performing spark-out by a grinding unit and the maximum load current in a motor of the grinding unit is grasped, and a correction value for the amount of inertial grinding corresponding to the maximum load current is preliminarily obtained. When the wafer thickness measured by a thickness measuring gauge has reached the sum of a desired value and the correction value (=the amount of inertial grinding) corresponding to the maximum load current, the spark-out is started. Accordingly, the wafer thickness becomes the desired value after the inertial grinding in performing the spark-out.
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