US Patent 7849749 Pressure sensor module
Patent 7849749 was granted and assigned to Fujikura on December, 2010 by the United States Patent and Trademark Office.
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Patent abstract
A pressure sensor module of the invention includes a pressure sensor and a laminar substrate. Electrodes are arranged in the vicinity of a diaphragm portion of the pressure sensor. In the laminar substrate, a plurality of substrates are laminated, and the laminar substrate incorporates the pressure sensor. One face of the diaphragm portion is exposed by a space portion. According to the invention, it is possible to provide a pressure sensor module which facilitates smaller and thinner sizes, and which enables high-density packaging.
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Patent Inventor Names
Mikio Hashimoto0
Satoshi Yamamoto0
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US Patent 07849749 Pressure sensor module US Patent 7849749 Pressure sensor module
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Patent Number
07849749
Patent Number
7849749
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Official Website
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US Patent 07849749 Pressure sensor module
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Is a
Current assignee
Patent jurisdiction
Patent number
07849749
Date of patent
December 14, 2010
Patent application number
12473822
Date Filed
May 28, 2009
Patent primary examiner
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