Patent attributes
The objective of the invention is to provide a semiconductor device manufacturing method with which the generation of burrs can be suppressed while increasing the singulation speed of the package. In a manufacturing method of a QFN package of the present invention, a molding prepared by sealing a lead frame with plural semiconductor chips carried on it en bloc with a resin; the operation comprises the following processing steps: a first singulation processing step S101 in which the molding is half-cut along the cutting plane; a de-flashing processing step S102 in which the burrs on the cut portion of the half-cut molding are removed; and a second singulation processing step S103 in which the de-flashed molding is completely cut along the cutting plane.
