Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chih Yi Huang0
Chih-Wei Wu0
Date of Patent
December 14, 2010
0Patent Application Number
122222000
Date Filed
August 5, 2008
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor structure comprising a first signal layer, a second signal layer, a wiring layer and at least one via is provided. The wiring layer is formed between the first signal layer and the second signal layer. A conducting wire is disposed between a first terminal and a second terminal on the wiring layer. At least one via is used to conduct the first signal layer and the second signal layer. The at least one via is disposed adjacent to the first terminal and the second terminal.
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