US Patent 7854365 Direct die attach utilizing heated bond head
Is a
Date Filed
October 27, 2008
0
Date of Patent
December 21, 2010
0
Patent Application Number
12258675
0
Patent Inventor Names
King Ming Lo
0
Kwok Kee Chung
0
Ming Li
0
Ping Liang Tu
0
Ying Ding
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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