US Patent 7855685 Microwave communication package

A microwave communication package is constructed on an electrically conducting base plate having a first side defining a base plate cavity, with an antenna apparatus mounted on an opposite, second side. A dielectric substrate on the first side of the base plate covers the base plate cavity; and sealing apparatus contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines communicating components to one or more waveguides comprising openings extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.