US Patent 7855891 Modular heat sinks for housings for electronic equipment

A housing for an outside plant telecommunication equipment (OSP) which uses modular heat sink assemblies. OSP housings contain electronic circuit boards on which are mounted electrical components that generate heat. Thermal conductors or mesas contact the electrical components to conduct heat from the components to the environment. Rather than create single purpose housings with cast thermal conductors, the improved housing uses heat sink plates which can easily be swapped out to accommodate a variety of electronic circuit boards that might be needed within a general purpose housing. Together with faster turnaround time to create a new design for a housing, lower manufacturing and inventory costs result.