Patent attributes
An LED lamp assembly includes a first heat sink, a plurality of second heat sinks secured to a periphery of the first heat sink, a plurality of LED modules respectively attached to the second heat sinks and a plurality of heat pipes interconnecting the first heat sink and the second heat sinks. The first heat sink comprises a heat conducting body defining a through hole therein and a plurality of first fins around the heat conducting body. The second heat sinks each comprise a plurality of second fins facing the first fins of the first heat sink. The heat pipes each comprise an evaporating section attached to a corresponding second heat sink and a condensing section extending into the through hole of the heat conducting body of the first heat sink and attached to the heat conducting body.