Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
December 28, 2010
Patent Application Number
11784081
Date Filed
April 5, 2007
Patent Primary Examiner
Patent abstract
Silica dielectric films, whether nanoporous foamed silica dielectrics or nonporous silica dielectrics are readily damaged by fabrication methods and reagents that reduce or remove hydrophobic properties from the dielectric surface. The invention provides for methods of imparting hydrophobic properties to such damaged silica dielectric films present on a substrate. The invention also provides plasma-based methods for imparting hydrophobicity to both new and damaged silica dielectric films. Semiconductor devices prepared by the inventive processes are also provided.
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