Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shin-Puu Jeng0
Benson Liu0
Hao-Yi Tsai0
Hsien-Wei Chen0
Date of Patent
December 28, 2010
0Patent Application Number
116190950
Date Filed
January 2, 2007
0Patent Primary Examiner
Patent abstract
A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die.
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