Patent attributes
A method for double patterning a thin film on a substrate is described. The method includes forming the thin film to be patterned on the substrate, forming a developable anti-reflective coating (ARC) layer on the thin film, and forming a layer of photo-resist on the ARC layer. Thereafter, the layer of photo-resist and the ARC layer are imaged with a first image pattern, and developed, thus forming the first image pattern in the ARC layer. The photo-resist is removed and another layer of photo-resist is formed on the ARC layer. Thereafter, the other layer of photo-resist and the ARC layer are imaged with a second image pattern, and developed, thus forming the second image pattern in the ARC layer. The other photo-resist layer is removed and a double patterned ARC layer remains for etching the underlying thin film.
