Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 4, 2011
Patent Application Number
12404213
Date Filed
March 13, 2009
Patent Citations Received
Patent Primary Examiner
Patent abstract
According to one embodiment, there is provided a printed circuit board including a plurality of electrode pads provided on a component mounting face on which a semiconductor component is to be mounted, a plurality of hole terminals provided on the component mounting face so as to correspond to the electrode pads, and a plurality of wiring pattern layers connecting the plurality of electrode pads and the plurality of hole terminals corresponding to the plurality of electrode pads, the plurality of wiring pattern layers being wired across directions of elastic deformation of the component mounting face.
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